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Name Date Size #Lines LOC

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READMED22-Nov-20231.1 KiB4330

m256.mntD22-Nov-20233.1 KiB9695

m256_bcmp.gbrD22-Nov-2023181.4 KiB9,7949,793

m256_bmsk.gbrD22-Nov-20233.7 KiB215214

m256_bslk.gbrD22-Nov-202352.7 KiB2,8572,856

m256_drl.drlD22-Nov-20234.5 KiB368367

m256_fab.pdfD22-Nov-2023337 KiB

m256_tcmp.gbrD22-Nov-2023353 KiB19,06319,062

m256_tmsk.gbrD22-Nov-2023136.4 KiB7,3837,382

m256_tpst.gbrD22-Nov-2023164.7 KiB8,9018,900

m256_tslk.gbrD22-Nov-2023291.8 KiB16,15316,152

README

1PCB Fabrication Package.  Google Mega2560 Arduino Rev. C 2011-03-23
2
3Gerber Files in RS-274-X Format
4   m256_tslk.gbr  - Top Silkscreen
5   m256_tpst.gbr  - Top Solderpaste (Stencil)
6   m256_tmsk.gbr  - Top Soldermask
7   m256_tcmp.gbr  - Top Copper
8   m256_bcmp.gbr  - Bottom Copper
9   m256_bmsk.gbr  - Bottom Soldermask
10   m256_bslk.gbr  - Bottom Silkscreen
11
12Drill files:
13   m256_drl.drl   - Excellon Drill file
14
15Fab drawing:
16
17   m256_fab.pdf
18
19Coordinates:
20
21   m256.mnt       - Top SMD coordinates
22
23Board dimensions/outline included as zero width trace in silkscreen layer
24for reference.  Board is made from 0.062" FR4 with 1oz copper on all
25layers.  Minimum trace/space is 6/6 mils.
26
27NOTE: Board contains 3 plated slots, each slot is marked at the two ends
28and center with 0.041" drills.
29
30Board layers stacked as follows:
31
32     Top Silkscreen (Black)
33     Top Soldermask (White)
34     Top Copper (1oz)
35     FR4 (62 mil)
36     Bottom Copper (1oz)
37     Bottom Soldermask (White)
38     Bottom Silkscreen (Black)
39
40Process the silkscreen layer against the soldermask layer to prevent
41overlapping silkscreen on the pads through mask openings.
42
43